Contents

1) MOBILE REPAIRING

• SEMISTER -1A : o Basic of mobile communication and electronics. o Study of digital electronics. o Assembling & Disassembling of different types of mobile phones. o Use of various tools & instruments used in mobile phone repairing.
• SEMISTER -1B : o Details of various components used in mobile phones. o Study of basic parts of mobile phones.(speaker,ic,etc). o Testing of various parts with multimeter. o Use of Jhatka machine.o SEMISTER -1B o Details of various components used in mobile phones. o Study of basic parts of mobile phones.(speaker,ic,etc). o Testing of various parts with multimeter. o Use of Jhatka machine.
• SEMISTER-2A : a):- Basic of mobile communication and electronics. b):- Name of different BGA ICs. c):- Work of different BGA and Glass ICs. d):- How to recognise different ICs.